15

High‐performance substrate from new epoxy resin and enhanced copper foil

Year:
2004
Language:
english
File:
PDF, 1.01 MB
english, 2004
16

New epoxy resins for printed wiring board applications

Year:
2007
Language:
english
File:
PDF, 259 KB
english, 2007
17

Influence of the binder system on current and future demands for base materials

Year:
2006
Language:
english
File:
PDF, 413 KB
english, 2006